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[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Formation and movement of voids in copper interconnect structures
de Orio, Roberto Lacerda, Selberherr, SiegfriedYear:
2012
Language:
english
DOI:
10.1109/ICSICT.2012.6467675
File:
PDF, 357 KB
english, 2012