[IEEE 2013 e-Manufacturing & Design Collaboration Symposium (eMDC) - Hsinchu, Taiwan (2013.9.6-2013.9.6)] 2013 e-Manufacturing & Design Collaboration Symposium (eMDC) - Detecting buried voids in copper interconnect
Liao, Hsiang-Chou, Tuung Luoh,, Ling-Wu Yang,, Tahone Yang,, Kuang-Chao Chen,, Chih-Yuan Lu,, Steve Lin,, Cheng, Alex, Yao, Ivan, SiYeul Yoon,, Moreau, Olivier, Xiao, HongYear:
2013
Language:
english
DOI:
10.1109/eMDC.2013.6756067
File:
PDF, 1.11 MB
english, 2013