[IEEE 2013 e-Manufacturing & Design Collaboration...

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[IEEE 2013 e-Manufacturing & Design Collaboration Symposium (eMDC) - Hsinchu, Taiwan (2013.9.6-2013.9.6)] 2013 e-Manufacturing & Design Collaboration Symposium (eMDC) - Detecting buried voids in copper interconnect

Liao, Hsiang-Chou, Tuung Luoh,, Ling-Wu Yang,, Tahone Yang,, Kuang-Chao Chen,, Chih-Yuan Lu,, Steve Lin,, Cheng, Alex, Yao, Ivan, SiYeul Yoon,, Moreau, Olivier, Xiao, Hong
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Year:
2013
Language:
english
DOI:
10.1109/eMDC.2013.6756067
File:
PDF, 1.11 MB
english, 2013
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