Mechanical properties of sintered Ag–Cu die-attach...

Materials & Design 2014 / 12 Vol. 64

Mechanical properties of sintered Ag–Cu die-attach nanopaste for application on SiC device

Tan, Kim Seah, Cheong, Kuan Yew
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
64
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2014.07.033
Date:
December, 2014
File:
PDF, 3.38 MB
english, 2014
Conversion to is in progress
Conversion to is failed