[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Electroless Cu seed on Ru and Co liners in high aspect ratio TSV
Inoue, F., Philipsen, H., van der Veen, M. H., Van Huylenbroeck, S., Armini, S., Struyf, H., Tanaka, T.Year:
2014
Language:
english
DOI:
10.1109/IITC.2014.6831871
File:
PDF, 836 KB
english, 2014