Thermal Analysis for Package Cooling Technology Using...

Thermal Analysis for Package Cooling Technology Using Phase-Change Material by Using Thermal Network Analysis and CFD Analysis With Enthalpy Porosity Method

Hatakeyama, Tomoyuki, Ishizuka, Masaru
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
35
Language:
english
Journal:
Heat Transfer Engineering
DOI:
10.1080/01457632.2013.876340
Date:
October, 2014
File:
PDF, 1.08 MB
english, 2014
Conversion to is in progress
Conversion to is failed