Non-porous ultra-low- k SiOCH ( k = 2.3) for damage-free integration and Cu diffusion barrier
Kikuchi, Yoshiyuki, Wada, Akira, Kurotori, Takuya, Sakamoto, Miku, Nozawa, Toshihisa, Samukawa, SeijiVolume:
46
Language:
english
Journal:
Journal of Physics D: Applied Physics
DOI:
10.1088/0022-3727/46/39/395203
Date:
October, 2013
File:
PDF, 1.01 MB
english, 2013