Analysis of Flip Chip Bonding for Performance Stability of...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 10 Vol. 4; Iss. 10

Analysis of Flip Chip Bonding for Performance Stability of UHF RFID Tags

Choo, Jaeyul, Ryoo, Jeongki
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2014.2345614
Date:
October, 2014
File:
PDF, 2.47 MB
english, 2014
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