Thickness-averaged model for numerical simulation of electroosmotic flow in three-dimensional microfluidic chips
Bo Chen 陈 波,Han Chen 陈 瀚,Jian-kang Wu 吴健康Volume:
34
Language:
english
Journal:
Applied Mathematics and Mechanics
DOI:
10.1007/s10483-013-1671-8
Date:
March, 2013
File:
PDF, 447 KB
english, 2013