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Peel strength of sputtered FCCL(Flexible Copper Clad Laminate) using Ar:O2mixed gas preprocessing and a Ni-Cr seed layer
Woo-Young Ahn,Joong Soon JangVolume:
10
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-013-3316-7
Date:
July, 2014
File:
PDF, 610 KB
english, 2014