Mechanical property evaluation of TSV-Cu micropillar by...

Electronic Materials Letters 2014 / 07 Vol. 10; Iss. 4

Mechanical property evaluation of TSV-Cu micropillar by compression method

Ting Gu,Ping Cheng,Su Wang,Huiying Wang,Xuhan Dai…
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Volume:
10
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-014-3286-4
Date:
July, 2014
File:
PDF, 539 KB
english, 2014
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