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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Air cooling limits of 3D stacked logic processor and memory dies
Kumari, Niru, Shih, Rocky, Escobar-Vargas, Sergio, Cader, Tahir, Govyadinov, Alexander, Anthony, Sarah, Bash, CullenYear:
2014
Language:
english
DOI:
10.1109/ITHERM.2014.6892269
File:
PDF, 579 KB
english, 2014