The contact resistance reduction of Cu interconnects by...

Materials Science in Semiconductor Processing 2014 / 11 Vol. 27

The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier

Wang, Wei-Lin, Peng, Kuo-Tzu, Kuo, Hsien-Chang, Yeh, Ming-Hsin, Chien, Hung-Ju, Ying, Tzung-Hua
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Volume:
27
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2014.08.035
Date:
November, 2014
File:
PDF, 1.21 MB
english, 2014
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