Quantitative comparison of sink efficiency of Cu–Nb, Cu–V and Cu–Ni interfaces for point defects
Mao, Shimin, Shu, Shipeng, Zhou, Jian, Averback, Robert S., Dillon, Shen J.Volume:
82
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2014.09.011
Date:
January, 2015
File:
PDF, 1.99 MB
english, 2015