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[IEEE 2014 IEEE Aerospace Conference - Big Sky, MT, USA (2014.3.1-2014.3.8)] 2014 IEEE Aerospace Conference - Aerospace electronic and photonic packaging: Predicted thermal stresses in Bi- and tri-material assemblies
Suhir, E., Nicolics, J., Bechou, L.Year:
2014
Language:
english
DOI:
10.1109/AERO.2014.6836166
File:
PDF, 318 KB
english, 2014