![](/img/cover-not-exists.png)
In situ cure monitoring of adhesively bonded joints by dielectrometry
Kwon, Jae Wook, Chin, Woo Seok, Lee, Dai GilVolume:
17
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856103772150733
Date:
January, 2003
File:
PDF, 885 KB
english, 2003