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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Novel nanospring interconnects for high-density applications
Lunyu Ma,, Qi Zhu,, Sitaraman, S.K., Chua, C., Fork, D.K.Year:
2001
Language:
english
DOI:
10.1109/ISAOM.2001.916604
File:
PDF, 739 KB
english, 2001