![](/img/cover-not-exists.png)
[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study of thin film metallization adhesion in ceramic multichip module
Lim Ju Dy,, Rong, E. P. J., Riko, I. M., Sharif, A., Lim Jun Zhang,, Lau Fu Long,, Gan Chee Lip,, Chen Zhong,, MinWoo, D. R., Wong Chee Cheong,Year:
2012
Language:
english
DOI:
10.1109/EPTC.2012.6507053
File:
PDF, 611 KB
english, 2012