[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect
Lu, Hua, Tilford, Tim, Bailey, Chris, Newcombe, David.R.Year:
2007
Language:
english
DOI:
10.1109/HDP.2007.4283558
File:
PDF, 425 KB
english, 2007