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[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Actual stresses around TSV in whole 3D-SiP under reflow or power ON/OFF thermal load
Kinoshita, Takahiro, Kawakami, Takashi, Wakamatsu, Takeshi, Shima, Shunpei, Matsumoto, Keiji, Kohara, Sayuri, Yamada, Fumiaki, Orii, YasumitsuYear:
2012
Language:
english
DOI:
10.1109/IMPACT.2012.6420223
File:
PDF, 770 KB
english, 2012