Effects of mechanical stress and moisture on packaging interfaces
S. L. Buchwalter, P. J. Brofman, C. Feger, M. A. Gaynes, K. Lee, L. J. Matienzo, D. L. QuestadVolume:
49
Year:
2005
Language:
english
DOI:
10.1147/rd.494.0663
File:
PDF, 498 KB
english, 2005