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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Condensation model of Vapour Phase Soldering
Illes, Balazs, Geczy, AttilaYear:
2012
Language:
english
DOI:
10.1109/SIITME.2012.6384347
File:
PDF, 1.89 MB
english, 2012