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[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - A cost effective TO-CAN packaged 10 Gbps EML module employing inductance compensation technique
Shirao, Mizuki, Ohata, Nobuo, Uto, Kenichi, Aruga, HiroshiYear:
2013
Language:
english
DOI:
10.1109/ICSJ.2013.6756087
File:
PDF, 1.07 MB
english, 2013