[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H., Auersperg, J., Koyuncu, M., Walter, H., Muller, W. H., Michel, B.Year:
2008
Language:
english
DOI:
10.1109/ESIME.2008.4525009
File:
PDF, 314 KB
english, 2008