[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Novel PEALD-Ru formation technique using H2 & H2/N2 plasma as a seed layer for direct CVD-Cu filling
Jeong, Daekyun, Inoue, Hiroaki, Ohno, Yoshiyuki, Namba, Kunitoshi, Shinriki, HiroshiYear:
2009
Language:
english
DOI:
10.1109/IITC.2009.5090350
File:
PDF, 503 KB
english, 2009