[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - The principal component analysis of Cu stud bump shaping process parameters
Mu, Wei, Wu, Zhaohua, Huang, ChunyueYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270733
File:
PDF, 1012 KB
english, 2009