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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages

Kanth, Kolan Ravi, Paghasian, Karen Yuag, Retuta, Danny, Toh, CH, Tanary, Susanto, Boon, Tan Hian
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Year:
2007
Language:
english
DOI:
10.1109/EPTC.2007.4469790
File:
PDF, 751 KB
english, 2007
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