Preparation and properties of the composite material...

Materials Science in Semiconductor Processing 2014 / 11 Vol. 27

Preparation and properties of the composite material silicon/polypyrrole–copper for electronic devices applications

Khaniche, Brahim, Benamrani, Hassen, Zouaoui, Ahmed, Zegadi, Ameur
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Volume:
27
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2014.07.027
Date:
November, 2014
File:
PDF, 1.01 MB
english, 2014
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