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[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Non-destructive techniques for internal solder bump inspection of chip scale package-ball grid array package
Lagar, Jason H., Sia, Rudolf A., Grancapal, Marlyn C.Year:
2014
Language:
english
DOI:
10.1109/IPFA.2014.6898178
File:
PDF, 3.58 MB
english, 2014