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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm
Quanyong Li,, Yubing Gong,, Daoguo Yang,, Junsheng Liang,Year:
2003
Language:
english
DOI:
10.1109/EPTC.2003.1298698
File:
PDF, 306 KB
english, 2003