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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Cu low k device wire bonding process modeling

Wang, ZhiJie, Huang, Vito, Yao, SuYing, He, ZhiLi, Jiang, Y.W., Zhang, C.L., Cao, Peline
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Year:
2007
Language:
english
DOI:
10.1109/ICEPT.2007.4441419
File:
PDF, 2.76 MB
english, 2007
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