[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology for high temperature automotive
Eu Poh Leng,, Poh Zi Song,, Au Yin Kheng,, Yong, C.C., Tran Tu, Anh, Arthur, John, Downey, Harold, Mathew, Varughese, Chee Yit Yin,Year:
2010
DOI:
10.1109/IEMT.2010.5746744
File:
PDF, 928 KB
2010