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[IEEE International Electron Devices Meeting 1991 [Technical Digest] - Washington, DC, USA (8-11 Dec. 1991)] International Electron Devices Meeting 1991 [Technical Digest] - A new three dimensional IC fabrication technology, stacking thin film DUAL-CMOS layers
Hayashi, Y., Oyama, K., Takahashi, S., Wada, S., Kajiyana, K., Koh, R., Kunio, T.Year:
1991
Language:
english
DOI:
10.1109/IEDM.1991.235336
File:
PDF, 337 KB
english, 1991