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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Solder cracking mechanism correlation to alloy composition under thermal cycling stress (part 1)
Chang, Shining, Wang, Rocky, Xiang, Yu, Chang, GibsonYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270690
File:
PDF, 1.10 MB
english, 2009