Lead-Free Flip-Chip Packaging Affects on Ultralow-$k$ Chip Delamination
Chen, Kuo Ming, Guu, Yunn Horng, Lin, Tsung ShuVolume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2193880
Date:
December, 2012
File:
PDF, 2.35 MB
english, 2012