Formation of Pb/63Sn solder bumps using a solder droplet...

IEEE Transactions on Electronics Packaging Manufacturing 2005 Vol. 28; Iss. 3

Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Ho-young Son, Jae-woong Nah, Kyung-wook Paik
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Volume:
28
Year:
2005
Language:
english
DOI:
10.1109/TEPM.2005.853068
File:
PDF, 1.92 MB
english, 2005
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