[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Development of a 65nm Cu/low-k Stack Die FBGA Package for SiP Applications
Zhang, Xiaowu, Premachandran, C. S., Chong, Ser-Choong, Wai, Leong Ching, Lee, Vincent, Chai, TC, Kripesh, V., Lau, John H., Sekhar, V.K., Wang, Sandy, Pinjala, D., Lee, Charles, Yeow, Siao LinYear:
2008
Language:
english
DOI:
10.1109/EPTC.2008.4763464
File:
PDF, 6.77 MB
english, 2008