[IEEE 2008 10th Electronics Packaging Technology Conference...

  • Main
  • [IEEE 2008 10th Electronics Packaging...

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Development of a 65nm Cu/low-k Stack Die FBGA Package for SiP Applications

Zhang, Xiaowu, Premachandran, C. S., Chong, Ser-Choong, Wai, Leong Ching, Lee, Vincent, Chai, TC, Kripesh, V., Lau, John H., Sekhar, V.K., Wang, Sandy, Pinjala, D., Lee, Charles, Yeow, Siao Lin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/EPTC.2008.4763464
File:
PDF, 6.77 MB
english, 2008
Conversion to is in progress
Conversion to is failed