[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Finite element modeling of solder joint fatigue in four-point bending test
Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, Vandepitte, Dirk, De Wolf, IngridYear:
2012
Language:
english
DOI:
10.1109/ESimE.2012.6191801
File:
PDF, 2.70 MB
english, 2012