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[IEEE Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Dallas, TX USA (March 14-16, 2006)] Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Reliability of stack packaging varying the die stacking architectures for flash memory applications
Hossain, M.M., Yongje Lee,, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.Year:
2006
Language:
english
DOI:
10.1109/STHERM.2006.1625232
File:
PDF, 909 KB
english, 2006