[IEEE Twenty-Second Annual IEEE Semiconductor Thermal...

  • Main
  • [IEEE Twenty-Second Annual IEEE...

[IEEE Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Dallas, TX USA (March 14-16, 2006)] Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium - Reliability of stack packaging varying the die stacking architectures for flash memory applications

Hossain, M.M., Yongje Lee,, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2006
Language:
english
DOI:
10.1109/STHERM.2006.1625232
File:
PDF, 909 KB
english, 2006
Conversion to is in progress
Conversion to is failed