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[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Driving mechanisms of delamination related reliability problems in exposed pad packages
van Driel, W.D., Bressers, H.J.L., Janssen, J.H.J., Bielen, J.A., Yan, X., van Gils, M.A.J., Stevens, P.M.P., Habets, P.J.J.H.A., Zhang, G.Q., Ernst, L.J.Year:
2005
Language:
english
DOI:
10.1109/ESIME.2005.1502797
File:
PDF, 1.14 MB
english, 2005