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[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Highly reliable PVD/ALD/PVD stacked barrier metal structure for 45-nm node copper dual-damascene interconnects
Higashi, K., Yamaguchi, H., Omoto, S., Sakata, A., Katata, T., Matsunaga, N., Shibata, H.Year:
2004
Language:
english
DOI:
10.1109/IITC.2004.1345664
File:
PDF, 232 KB
english, 2004