[IEEE 2011 IEEE 13th Electronics Packaging Technology...

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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - TSV via-last: Optimization of multilayer dielectric stack etching

Loh Woon Leng,, Li Hongyu,, Keng Hwa Teo,, Murthy, Ramana, Eugene Tan Swee Kiat,
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Year:
2011
Language:
english
DOI:
10.1109/EPTC.2011.6184491
File:
PDF, 1.97 MB
english, 2011
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