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[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Packaging and interconnect design and analysis using FDTD
Piket-May, M., Thomas, K., Gravrok, R.Year:
1997
Language:
english
DOI:
10.1109/EPEP.1997.634045
File:
PDF, 362 KB
english, 1997