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[IEEE 2011 International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2011.03.14-2011.03.16)] 2011 12th International Symposium on Quality Electronic Design - 3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement
Kwai, Ding-Ming, Lin, Chang-TzuYear:
2011
DOI:
10.1109/ISQED.2011.5770715
File:
PDF, 371 KB
2011