[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Growth models of copper filling in through silicon via at different current density
Wang, Zhaoyu, Cheng, Ping, Wang, Hong, Guo, Honglei, Ding, Guifu, Zhao, Xiaolin, Li, JianhuaYear:
2013
Language:
english
DOI:
10.1109/ICSJ.2013.6756084
File:
PDF, 823 KB
english, 2013