[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Cu / Barrier Metal Stack Film Characterization for Reliability Estimation
Ogawa, Shinichi, Ohdaira, Toshiyuki, Hosoi, Nobuki, Tarumi, Nobuaki, Suzuki, Ryoichi, Saito, ShuichiYear:
2007
Language:
english
DOI:
10.1109/IITC.2007.382339
File:
PDF, 486 KB
english, 2007