In-situ prediction of reactive ion etch endpoint using...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 Vol. 18; Iss. 3

In-situ prediction of reactive ion etch endpoint using neural networks

M. Baker, C. Himmel, G. May
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Volume:
18
Year:
1995
Language:
english
DOI:
10.1109/95.465140
File:
PDF, 640 KB
english, 1995
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