Runtime Thermal Management for 3-D Chip-Multiprocessors...

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2015 / 3 Vol. 23; Iss. 3

Runtime Thermal Management for 3-D Chip-Multiprocessors With Hybrid SRAM/MRAM L2 Cache

Lee, Seunghan, Kang, Kyungsu, Kyung, Chong-Min
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/TVLSI.2014.2311798
Date:
March, 2015
File:
PDF, 3.73 MB
english, 2015
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