[IEEE 2007 International Conference on Thermal, Mechanical...

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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Comparative Sensitivity Analysis for μBGA and QFN Reliability

Wilde, Jurgen, Zukowski, Elena
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Year:
2007
Language:
english
DOI:
10.1109/ESIME.2007.360051
File:
PDF, 580 KB
english, 2007
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