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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Integration of GaN thin film and dissimilar substrate material by Au-Sn wafer bonding and CMP
Zhou, Shengjun, Chen, Zhaohui, Cao, Bin, Liu, ShengYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270705
File:
PDF, 1.15 MB
english, 2009