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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - BGA package integration of electrical, optical, and capacitive interconnects
Zheng, Xuezhe, Lexau, Jon, Rolston, David, Cunningham, John E., Shubin, Ivan, Ho, Ron, Krishnamoorthy, Ashok V.Year:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074015
File:
PDF, 1.44 MB
english, 2009